IZMO successfully designs 3D System-in-Package (SiP) module for Space Payload Camera Electronics

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
The Engineer

Analog Devices Launches Industry’s First High-Resolution Module for 3D Depth Sensing and Vision Systems

Analog Devices, Inc. has announced the industry’s first high-resolution, industrial quality, indirect Time-of-Flight (iToF) module for 3D depth sensing and vision systems. Enabling cameras and sensors ...
Geeky Gadgets

Co Print Bowden 3D printer multi-filament module

3D printing enthusiasts may be interested in a new Bowden 3D printer accessory in the form of Co Print a multi-filament module that can easily be attached to a wide-ranging existing 3D printers ...
Electronic Design

Module Integrates 3D Time-of-Flight Sensor

In the video, Erik Barnes shows off the power-efficient, 1-Mpixel, 3D TOF sensor in the company's eval module. The module is built into a custom, handheld capture system. The ADTF3175 chip has 1k × 1k ...