Samsung has pushed forward with another industry-first, applying a 3D stacking to a 7nm EUV system chips. Dubbed X-Cube, the concept is at once complex and straightforward. In effect, Samsung has ...
Samsung Electronics has successfully applied 3D stacking technology on a test chip that was made using the 7nm extreme ultraviolet (EUV) chip making process, the company said on Thursday. Dubbed ...
This file type includes high resolution graphics and schematics. The final spec for the Hybrid Memory Cube (HMC) is done. Designed to improved DRAM performance by a factor of 15, the Hybrid Memory ...
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