Semiconductor Engineering

3D Stacked Device Architecture Enabled By BEOL-Compatible Transistors (Stanford et al.)

A new technical paper titled “Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock” was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon ...
Mena FN

Silicon Genesis Extends Its NANOCLEAVETM Layer Transfer Process For 3DIC Integration To Interconnect Network Layers

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
Nature

BEOL Three-Dimensional Stackable Oxide Semiconductor CMOS Inverter with a High Voltage Gain of 233 at Cryogenic Temperatures

The Nature Index 2025 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...
Electronics Weekly

Backside Power Delivery by imec

Backside Power Delivery is seen as one of the most important technologies for future IC process improvements. Intel says it will introduce the technology in products next year, TSMC says it will be ...
KOIN 6

Silicon Genesis extends its NANOCLEAVE™ Layer Transfer Process for 3DIC Integration to Interconnect Network Layers

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...