For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.
Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration, according to ...
New York, June 15, 2023 (GLOBE NEWSWIRE) -- In 2022, the global IC sockets market generated US$ 858.7 million in terms of revenue. It is anticipated to exceed a 4.4% CAGR between 2023 and 2033. By the ...
The Giga-snap SFS-BGA200B-52 socket allows an 11 x 14.5-mm, 200-ball BGA IC with a 0.65-mm pitch, 12 x 22-array to be placed in a socket with the same footprint as the IC to avoid compromising ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results