A high-stakes patent dispute between Hanwha Semitech and Hanmi Semiconductor over a critical piece of equipment in the HBM production process — the TCB machine — is set to unfold, with significant ...
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company defends its ...
Samsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory (HBM), a move expected to reshape the global semiconductor equipment ...
A power struggle is unfolding in South Korea’s semiconductor industry as SK Hynix seeks to diversify its suppliers of thermal compression bonders (TC bonders), crucial for high-bandwidth memory (HBM) ...
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