Winning in the market place requires system development teams to put better product to the market ahead of competition. At the same time cost of the product needs to be reduced. Integration of more ...

The integration flow and Virtuoso chip editor give designers an integrated physical design suite, from floorplanning through chip finishing and tapeout. It offers a seamless, bidirectional path to and ...

Today’s semiconductor designs support a broad range of applications, from mobile and edge devices to AI accelerators and data center systems. To keep pace, design teams are shifting from monolithic ...

(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...

As 2015 comes to an end rapidly, the key question becomes what the next year will bring. Last year around this time, in my blog “The Next Big Shift In Verification”, I talked about software-driven ...