In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

The joint venture MOU is part of a strategy to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing (HPC).

Samsung Electro-Mechanics said that Executive Director Hwang Chi-won (head of the package development team) received a presidential citation at the 20th Electronics and IT Day awards ceremony held on ...

[Asia Economy Reporter Suyeon Woo] As the semiconductor industry experiences a boom, supply shortages have extended to the raw material package substrates, rapidly improving the profitability of ...

Samsung Electro-Mechanics and LG Innotek announced on the 3rd that they will participate in the 'International PCB and Semiconductor Packaging Exhibition' (KPCA Show 2025), held at Songdo Convensia in ...

TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...

Sumitomo Chemical Chairman Keiichi Iwata (left) and Samsung Electro-Mechanics President Duckhyun Chang sign an MOU. The joint venture MOU is part of a strategy to overcome the limitations of package ...