Apple (AAPL) and Qualcomm (QCOM) are concerned about the strained supplies of Japan's high-end glass cloth fiber, Nikkei Asia ...

TSMC's demand for CoWoS chipmaking materials has become so great that it is causing material shortages in the memory market. Mitsubishi Gas Chemical has announced to clients that shipments of raw ...

A new material for flexible electronics could enable multilayered, recyclable electronic devices and help limit e-waste. Electronic waste, or e-waste, is a rapidly growing global problem, and it's ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Epitaxial growth is a fundamental process in semiconductor manufacturing. It refers to depositing a thin, crystal layer on a crystal substrate, with a specific orientation. This layer closely ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Benchmark of ...